Heater assembly for printhead

ABSTRACT

A heater assembly for a printhead is provided having a heating element including a heating layer and a non-heating layer, and a heat conduction means positioned in the middle of the non-heating layer so as to be spaced from the heating layer to conduct heat generated by the heating element away from the actuator assembly.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is a continuation of U.S. Ser. No. 12114816 filed May5, 2008, which is a continuation of U.S. Ser. No. 10/510,096 filed onOct. 5, 2004, now issued U.S. Pat. No. 7,661,792, which is nationalphase (35 U.S.C. 371) application of PCT/AU02/00775, filed on Jun. 14,2002, which is a Continuation of U.S. Ser. No. 10/120,359, now IssueU.S. Pat. No. 6,688,719, filed on April 12, 2002.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the field of inkjet printing and, inparticular, discloses an improved thermoelastic inkjet actuator.

2. Description of Related Art

Thermoelastic actuator inkjet nozzle arrangements are described in U.S.patent applications Ser. Nos. U.S. 09/798,757 and U.S. 09/425,195 whichare both co-owned by the present applicant and herein incorporated bycross reference in their entireties.

A first nozzle according to an embodiment of the invention described inthat document is depicted in FIG. 1. FIG. 1 illustrates a sideperspective view of the nozzle arrangement and FIG. 2 is an explodedperspective view of the nozzle arrangement of FIG. 1. The single nozzlearrangement 1 includes two arms 4, 5 which operate in air and areconstructed from a thin 0.3 micrometer layer of titanium diboride 6 ontop of a much thicker 5.8 micron layer of glass 7. The two arms 4, 5 arejoined together and pivot around a point 9 which is a thin membraneforming an enclosure which in turn forms part of the nozzle chamber 10.the arms 4 and 5 are affixed by posts 11, 12 to lower aluminiumconductive layers 14,15 which can form part of the CMOS layer 3. Theouter surfaces of the nozzle chamber 18 can be formed from glass ornitride and provide an enclosure to be filled with ink. The outerchamber 18 includes a number of etchant holes e.g. 19 which are providedfor the rapid sacrificial etchant of internal cavities duringconstruction by MEM processing techniques.

The paddle surface 24 is bent downwards as a result of the release ofthe structure during fabrication. A current is passed through thetitanium boride layer 6 to cause heating of this layer along arms 4 and5. The heating generally expands the T1B2 layer of arms 4 and 5 whichhave a high Young's modulus.

This expansion acts to bend the arms generally downwards, which are inturn pivoted around the membrane 9. The pivoting results in a rapidupward movement of the paddle surface 24. The upward movement of thepaddle surface 24 causes the ejection of ink from the nozzle chamber 21.The increase in pressure is insufficient to overcome the surface tensioncharacteristics of the smaller etchant holes 19 with the result beingthat ink is ejected from the nozzle chamber hole 21.

As noted previously the thin titanium diboride strip 6 has asufficiently high young's modulus so as to cause the glass layer 7 to bebent upon heating of the titanium diboride layer 6. Hence, the operationof the inkjet device is as illustrated in FIGS. 3-5. In its quiescentstate, the inkjet nozzle is as illustrated in FIG. 3, generally in thebent down position with the ink meniscus 30 forming a slight bulge andthe paddle being pivoted around the membrane wall 9. The hearing of thetitanium diboride layer 6 causes it to expand. Subsequently, it is bentby the glass layer 7 so as to cause the pivoting of the paddle 24 aroundthe membrane wall 9 as indicated in FIG. 4. This causes the rapidexpansion of the meniscus 30 resulting in a positive pressure pulse andthe general ejection of ink from the nozzle chamber 10. Next the currentto the titanium diboride is switched off and the paddle 24 returns toits quiescent state resulting in a negative pressure pulse causing ageneral sucking back of ink via the meniscus 30 which in turn results inthe ejection of a drop 31 on demand from the nozzle chamber 10.

By shaping the electrical heating pulse the magnitude and time constantsof the positive pressure pulse of the thermoelastic actuator may becontrolled. However, the negative pressure pulse remains uncontrolled.The characteristics of the negative pressure pulse becomes moreinfluential for fluids of high viscosity and high surface. Accordinglyit would be desirable if theromelastic inkjet nozzles with tailorednegative pressure pulse characteristics were available.

A further difficulty with some types of thermoelastic actuators is thatit is not unusual for very high temperature actuators to inducetemperatures above the boiling point of any given liquid on the bottomsurface of the non-conductive layer. It is an object of the presentinvention to provide a thermoelastic actuator with a tailored negativepressure pulse characteristic.

BRIEF SUMMARY OF THE INVENTION

According to a first aspect of the present invention there is provided athermoelastic actuator assembly including:

a heat conduction means positioned to conduct heat generated by aheating element away from said actuator assembly thereby facilitatingthe return of the actuator to a quiescent state subsequent to operation.

Preferably the heating element comprises a heating layer which is bondedto a passive bend layer wherein the heat conduction means is locatedwithin the passive bend layer.

The heat conduction means may comprise one or more layers of a metallicheat conductive material located within the passive bend layer.

Preferably the one or more layers of metallic heat conductive materialis sufficient to prevent overheating of ink in contact with saidactuator.

Typically the one or more layers of metallic heat conductive materialcomprise a laminate of heat conductive material, for example Aluminium,and passive bend layer substrate.

It is envisaged that the thermoelastic actuator be incorporated into anink jet printer.

A method of producing a thermoelastic actuator assembly having desiredoperating characteristics including the steps of:

determining a desired negative pressure pulse characteristic for theactuator;

determining a heat dissipation profile corresponding to the desirednegative pressure pulse characteristic; and

forming the thermoelastic actuator with a heat conduction means arrangedto realize said profile.

Preferably the step of determining a desired negative pressure pulsecharacteristic includes a step of determining the physical qualities ofa fluid to be used with the thermoelastic actuator.

The step of forming the thermoelastic actuator with a heat conductionmeans arranged to realize said profile may include forming one or moreheat conductive layers in a passive bend layer of the actuator.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a prior art thermoelastic actuator.

FIG. 2 is an exploded view of the thermoelastic actuator of FIG. 1.

FIG. 3 is a cross sectional view of the thermoelastic actuator of FIG. 1during a first operational phase.

FIG. 4 is a cross section view of the thermoelastic actuator of FIG. 1during a second operational phase.

FIG. 5 is a cross sectional view of the thermoelastic actuator of FIG. 1during a further operational phase.

FIG. 6 is a cross sectional view of a portion of a prior artthermoelastic actuator assembly.

FIG. 7 is a cross sectional view of a portion of a thermoelasticactuator assembly according to a first embodiment of the presentinvention.

FIG. 8 is a cross sectional view of a portion of a thermoelasticactuator assembly according to a second embodiment of the presentinvention.

FIG. 9 is a cross sectional view of a portion of a thermoelasticactuator assembly according to a further embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIG. 6, there is depicted a simplified side profile of aportion of a prior art thermoelastic actuator 40. Actuator 40 includes aheating element in the form of a heater layer 42 and a passive bendlayer 44. Typically the passive bend layer comprises an insulator of lowthermal conductivity such as Silicon Dioxide. A fluid such as ink fillsreservoir 46. The direction of heat flow from heater layer 42 isindicated by arrows 50 and 52.

A preferred embodiment of a thermoelastic actuator according to thepresent invention will now be described with reference to FIG. 7. Theactuator includes a thin layer 54 of very high thermally conductivematerial, such as Aluminium located in the middle of the non-heatconductive passive bend layer 56. Thus as heat energy is conducted awayfrom the heater layer it ultimately encounters the conductive layer andis conducted away as indicated by arrows 58. The heat is conducted awayfrom the actuator by heat conductive layer 54 to the large relativelycold thermal mass of the supporting structure (not shown) as opposed tofurther conduction through the thickness of the actuator itself.

The overall cool-down speed of the actuator, and hence the speed withwhich the passive bend layer returns to its quiescent position, and sothe shape of the negative pressure pulse, can be controlled by theproximity of heat conductive layer 54 to heater layer 58. Locating theheat conductive layer closer to the heater layer results in an actuatorthat cools down more quickly.

The heat conductive layer may be positioned to prevent the bottomsurface of the bonded actuator from getting excessively hot, thus theactuator can be in direct contact with any given fluid without causingboiling or overheating.

FIG. 8 depicts a thermoelastic actuator according to a furtherembodiment of the invention wherein the conductive pathway comprises alaminate 60 of three Aluminium layers and passive bend material. Byalternating Aluminium layers with the passive bend material the effectof the heat conductive layers on the mechanical characteristics of theactuator may be minimized. Alternatively a single layer of another heatconductive material having a relatively low Young's Modulus might beused so as not to interfere with the mechanical characteristics of theactuator.

In the embodiments of FIGS. 7 and 8 the heating layer 58 is directly andcontinuously bonded to the passive bend layer 56. In so called“isolated” type thermoelastic actuators a heating element is notcontinuous with a passive substrate but is partly separated from it byan air space. In FIG. 9 there is shown a further embodiment of theinvention applied to an isolated type actuator wherein a heating element64 is partly separated from passive substrate 56 by an air space 62.Once again heat conductive layer 54 acts to conduct heat away towardsthe actuator support assembly (not shown).

The present invention provides an actuator with a tailored negativepulse characteristic. This has been done by providing a heat conductionmeans in the form of a layer of a good heat conductor such as Aluminium.By varying the heat conduction properties of the actuator the cool downtime may be increased so that the actuator will return more quickly toits quiescent position. Accordingly the present invention alsoencompasses a method for designing actuators to have desiredcharacteristics.

The method involves firstly determining a desired negative pressurepulse characteristic for the actuator. The pressure pulse characteristicwill be due to the speed with which the actuator returns to itsquiescent position. Typically the negative pressure pulse will bedesigned to cause necking of ink droplets for ink of a particularviscosity.

Once the pressure pulse characteristic has been decided upon a heatdissipation profile corresponding to the desired negative pressure pulsecharacteristic is determined The determination may be made by means of atrial and error process if necessary or alternatively mathematicalmodeling techniques may be utilized. The thermoelastic actuator is thenfabricated with a heat conduction layer arranged to realize saidprofile.

It may be simplest to form the actuator with a number of heat conductivelayers in order to preserve the mechanical characteristics of thepassive bend layer thereby reducing the number of variables involved inrealizing the heat dissipation profile.

It will be realized that the actuator will find application in inkjetprinter assemblies and ink jet printers.

Although the present invention has been described with reference topreferred embodiments, workers skilled in the art will recognize thatchanges may be made in form and detail without departing from the spiritand scope of the invention.

1. A heater assembly for a printhead, the assembly comprising: a heatingelement including a heating layer and a non-heating layer; and a heatconduction means positioned in the middle of the non-heating layer so asto be spaced from the heating layer to conduct heat generated by theheating element away from said actuator assembly.
 2. An assemblyaccording to claim 1, wherein the heat conduction means comprises one ormore layers of a metallic heat conductive material located within thenon-heating layer.
 3. An assembly according to claim 2, wherein the oneor more layers of metallic heat conductive material is sufficient toprevent overheating of fluid in contact with the assembly.
 4. Anassembly according to claim 2, wherein the one or more layers ofmetallic heat conductive material comprise a laminate of heat conductivematerial and the material of the non-heating layer.
 5. An assemblyaccording to claim 4, wherein the one or more layers of metallic heatconductive material comprise Aluminium.